Hypro Lapping

Hypro Lapping

The Hypro lap creates flatness on warped or distorted surfaces. Our Hypro lap equipment is particularly good at finishing non-magnetic materials when a smooth surface is needed. Hypro lapping also runs at a fast production rate. It can achieve finishes to 5 micro-inches, with tolerances to .0002″ flat and parallel within the same limit. Thin, small, and odd-shaped parts, with a maximum diameter of 8″, can also be ground. These features are ideal for industries that need tool and die lapping services to keep part shape and tight tolerances.

Micro lapping and loose abrasive lapping are available using a wide range of compounds and slurries. Lapping and polishing help reach a needed surface finish, flatness, and parallelism. In this process, spinning flat surfaces wear down the ceramic part with diamond or other abrasive lapping compounds. These steps are often used in aerospace component lapping, where accuracy and safety matter most. Additionally, double disc surface grinding services can complement lapping by providing precise material removal and enhancing surface quality for critical applications.

The surface finish is controlled by picking the right abrasive, pressure, and lapping cycle. U.G.C. also supports low-emission grinding operations, helping clients meet both precision and environmental goals. We regularly work with many materials, offering polishing and lapping for both custom low-volume jobs and large production runs.

Whether it’s holding flatness tight or reducing thickness to match rare substrate sizes, we bring experience from the early ’40s. This depth of knowledge also supports our cylindrical grinding contract manufacturing services, where detailed part specs must be met every time.

Our experience extends to complex tool and die lapping services, where parts often need very strict tolerances. We also support aerospace component lapping, helping customers meet high standards for tough and reliable parts. In addition, we offer double disc surface grinding services to increase efficiency when flatness and parallelism are key for two-sided grinding.

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